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  DOI Prefix   10.20431


 

International Journal of Modern Studies in Mechanical Engineering
Volume 5, Issue 1, 2019, Page No: 37-40
doi:dx.doi.org/10.20431/2454-9711.0501003

Residual Stress on A MEMS Structure: A Survey

Basavaraj Kawdi1*, Vrushabha C M2

1.Mechanical Engineering Department, BKIT Bhalki India.
2.Gogte Institute of Technology, Belagavi India.

Citation : Basavaraj Kawdi, Vrushabha C M , Residual Stress on A MEMS Structure: A Survey International Journal of Modern Studies in Mechanical Engineering 2019, 5(1) : 37-40.

Abstract

A new approach to the local measurement of residual stress in microstructures is described in this paper. The presented technique takes advantage of the combined milling-imaging features of a focused ion beam (FIB) equipment to scale down the widely known hole drilling method. This method consists of drilling a small hole in a solid with inherent residual stresses and measuring the strains/displacements caused by the local stress release that takes place around the hole. In the presented case, the displacements caused by the milling are determined by applying digital image correlation (DIC) techniques to high resolution micrographs taken before and after the milling process. The residual stress value is then obtained by fitting the measured displacements to the analytical solution of the displacement fields. The feasibility of this approach has been demonstrated on a micro machined silicon nitride membrane showing that this method has high potential for applications in the field of mechanical characterization of micro/Nano-electro mechanical systems.


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